306-025-421-107

Overview

The EDAC Inc. 306-025-421-107 is a standard card edge connector from the 306 series, designed for dual-edge PCB applications. It features 50 positions with a 3.96 mm (0.156 inch) pitch and supports board thicknesses between 1.37 mm and 1.78 mm. The connector utilizes tin-plated copper alloy contacts and a green thermoplastic polyester housing. Rated for 5 A current, it operates within a temperature range of -40°C to +105°C. Installation is achieved via panel mount through-hole soldering, ensuring reliable electrical interconnection in industrial environments.

Feature Summary

• Dual-edge female contact configuration for secure mating with double-sided circuit boards
• Panel mount installation style with through-hole solder termination for mechanical stability
• Thermoplastic polyester insulation providing durability across specified operating temperatures

Applications

• Industrial control systems requiring robust card edge interfaces
• Telecommunications equipment utilizing standardized module connections
• Test and measurement instrumentation with high-reliability signal paths

Procurement Notes

Verify the specific contact plating finish against project requirements, as datasheet references indicate variations such as tin or gold depending on suffix codes. Confirm that the panel mount orientation aligns with chassis design constraints. Ensure the selected variant matches the required thermal rating and environmental compliance standards before finalizing procurement orders.

Selection Notes

Select this component when a dual-edge connection with a 3.96 mm pitch is necessary for panel-mounted assemblies. Consider the 5 A current rating and -40°C to +105°C operational range for suitability in demanding environments. Verify compatibility with the target PCB thickness range of 1.37 mm to 1.78 mm to ensure proper mechanical engagement and electrical continuity during operation.

Part Context

This part belongs to the EDAC 306 series of standard card edge connectors, which are widely used in modular electronic designs. The series offers various position counts and mounting options to accommodate different form factors. The 306-025-421-107 specifically addresses needs for dual-edge connectivity with panel-mount stability, fitting into broader system architectures requiring durable, high-density interconnect solutions.

Replacement Considerations

Cross-reference with other EDAC 306 series variants sharing identical pitch and position counts. Verify that alternative parts match the dual-edge configuration and panel mount specifications. Ensure equivalent material properties and electrical ratings are maintained to preserve system integrity without redesign.