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The EDAC Inc. 306-025-521-168 is a standard card edge connector from the 306 series, designed for single-row applications. It features 25 positions with a contact spacing of 0.156 inches (3.96 mm). The connector utilizes gold-plated copper alloy contacts and accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). Constructed with a thermoplastic insulator body, it supports panel mount installation in a vertical orientation. The component operates within a temperature range of -40°C to +105°C and provides an insulation resistance of 5 GOhms.
Verify that the specific ordering suffix matches the required contact plating and housing color specifications. Confirm compatibility with the target PCB thickness of 0.062 inches to ensure proper mechanical retention. Check RoHS compliance status against current regulatory requirements for the intended market. Ensure the vertical mounting style aligns with the chassis layout constraints before finalizing procurement orders.
Select this component when a single-row connection with 3.96 mm pitch is required for thick PCBs. The 25-position count suits moderate density interconnect needs. Consider the vertical panel mount requirement for fixed installations. Evaluate the operating temperature range against environmental conditions. Compare against other 306 series variants if different pin counts or spacings are needed.
This part belongs to the EDAC 306 series of standard card edge connectors. The series is characterized by its low-profile design and suitability for single-sided card edges. It complements other EDAC products like the 302 and 396 series, which offer different pitches and row configurations. The 306 series specifically targets applications needing wider spacing and thicker board support.
Direct substitutes include other EDAC 306 series parts with matching position counts and pitch. Verify equivalent electrical ratings and mechanical dimensions before substitution. Cross-reference with distributor databases for availability of identical specifications.