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The EDAC Inc. 306-026-400-102 is a standard card edge connector from the 306 series, designed for reliable interconnection in electronic assemblies. It features a dual female configuration with 52 positions and a contact spacing of 0.156 inches (3.96 mm). The connector accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). Constructed with a low-profile insulator body, it utilizes gold-plated copper alloy contacts to ensure signal integrity and corrosion resistance. This component is engineered for panel mounting applications, providing a secure mechanical interface for high-density board-to-board connections.
Verify the specific ordering suffix against the official EDAC datasheet to confirm pin count, contact plating, and board thickness compatibility. Ensure the selected variant matches the required PCB dimensions and mounting style. Cross-reference the manufacturer part number with authorized distributors to confirm current availability and compliance status before procurement.
Select this connector when a 52-position dual-row interface is required for 0.062-inch thick boards. The 3.96 mm pitch supports high-density layouts within standard form factors. Verify that the application environment does not exceed the thermal limits of the thermoplastic housing. Confirm that the panel mounting style aligns with the mechanical design constraints of the target assembly.
EDAC Inc., established in 1966, specializes in complex interconnect solutions for global OEMs. The 306 series represents their standard card edge connector line, widely used in computing, medical, and industrial sectors. This specific model leverages EDAC's Total Quality System to ensure error-free delivery and rigorous inspection standards for critical infrastructure applications.
Direct substitutes within the 306 series include variants with different position counts or plating options, such as 306-026-400-158. Verify dimensional compatibility and electrical ratings before substitution. No alternative manufacturers are confirmed in public documentation.