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The EDAC Inc. model 306-026-400-103 is a standard card edge connector from the 306 series, designed for panel installation with vertical orientation. It features a single row of 52 female positions with a 3.96 mm (0.156 inch) contact spacing. The connector accepts printed circuit boards with a nominal thickness of 1.57 mm and utilizes tin-plated copper alloy contacts. Constructed with a green thermoplastic insulator body, it operates within a temperature range of -40°C to +105°C and provides an insulation resistance of 5 GOhms.
Verify that the specific ordering suffix matches the required termination style and plating finish, as variations exist within the 306 series. Confirm compatibility with the target PCB thickness of 1.57 mm to ensure proper mechanical engagement. Check current availability status through authorized distributors, as supply levels may fluctuate. Ensure compliance with RoHS directives if required by the end application specifications.
Select this component when a single-row, panel-mount configuration is required for vertical board insertion. The 3.96 mm pitch suits applications needing robust mechanical stability with moderate pin counts. Consider the tin plating for general-purpose use rather than high-frequency or corrosive environments where gold might be preferred. Verify that the 52-position count aligns with the signal requirements of the design.
This part belongs to the EDAC 306 series of standard card edge connectors, which are characterized by their versatility in mounting styles and termination options. The series supports various board thicknesses and offers multiple contact configurations. The 306-026-400-103 specifically addresses needs for high-density connections in a compact vertical profile, fitting into broader industrial and commercial hardware ecosystems.
Direct substitutes within the same series include parts with identical pitch and position counts but different plating or termination methods. Cross-series replacements require matching the 3.96 mm spacing and 1.57 mm board thickness constraints. Verify mechanical footprint compatibility before integrating alternative models.