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Product Detailed Parameters
- Description：CONN EDGE DUAL FMALE 52POS 0.156
- Series：306
- Mfr：EDAC Inc.
- Package：Bulk
- Card Type：Non Specified - Dual Edge
- Gender：Female
- Number of Positions/Bay/Row：26
- Number of Positions：52
- Card Thickness：0.054" ~ 0.070" (1.37mm ~ 1.78mm)
- Number of Rows：2
- Pitch：0.156" (3.96mm)
- Read Out：Dual
- Features：Card Guides
- Mounting Type：Panel Mount
- Termination：Solder Eyelet(s)
- Contact Material：Copper Alloy
- Contact Finish：Tin
- Contact Finish Thickness：-
- Contact Type：Cantilever
- Color：Green
- Flange Feature：Flush Mount, Top Opening, Threaded Insert, 4-40
- Operating Temperature：-40°C ~ 105°C
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Overview
The EDAC Inc. 306-026-400-178 is a standard card edge connector receptacle from the 306 series. It features a dual female configuration with 52 positions arranged in two rows. The contact spacing is 0.156 inches (3.96 mm). Designed for through-hole mounting, it accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). The unit utilizes gold-plated copper alloy contacts and a thermoplastic polyester insulator body.
Feature Summary
- Dual female contact configuration for secure board retention
- Gold-plated copper alloy contacts ensure reliable signal transmission
- Thermoplastic polyester insulator provides structural stability
Applications
- Industrial control system interconnects
- Telecommunications equipment backplanes
- Computing hardware motherboard connections
Procurement Notes
Verify the specific ordering suffix to confirm pin count and row configuration. Ensure compatibility with the target PCB thickness of 0.062 inches. Confirm that the through-hole termination method aligns with the assembly process. Check RoHS compliance status against current regulatory requirements before finalizing procurement orders.
Selection Notes
Select this component when a high-density dual-row connection is required for standard thickness boards. The 3.96 mm pitch offers robust mechanical engagement compared to finer pitches. Consider the straight mounting style for panel or chassis integration where space constraints allow vertical insertion.
Part Context
This part belongs to the EDAC 306 series, which provides extensive design options for card edge applications. The series allows for tailored interconnect solutions by varying position counts and configurations. It serves as a standardized solution for connecting edge-boarded modules to host systems.
Replacement Considerations
Cross-reference with other EDAC 306 series variants for different position counts. Verify that any substitute maintains the 0.156 inch pitch and dual female interface. Ensure the replacement supports the same 0.062 inch board thickness specification.
