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The EDAC Inc. 306-027-420-158 is a dual female card edge connector featuring 54 positions arranged in two rows of 27 contacts per row. It utilizes a 0.156-inch (3.96mm) contact spacing and accepts printed circuit boards with thicknesses ranging from 0.054 to 0.070 inches. The component employs gold-plated cantilever contacts for reliable signal transmission and is constructed with a green thermoplastic polyester insulator. Designed for panel mounting via threaded inserts, it supports through-hole solder termination and operates within a temperature range of -40°C to +105°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to ensure correct pin count, contact plating thickness, and insulation material properties. Confirm that the required PCB thickness falls within the specified operational range of 0.054 to 0.070 inches. Check for RoHS compliance status and environmental certifications relevant to your deployment region before finalizing procurement orders.
Select this connector when high-density interconnection is required with a 0.156-inch pitch. Ensure the application environment remains within the -40°C to +105°C operating temperature limits. Verify that the mechanical constraints allow for panel mounting with the specified flange dimensions. Consider the through-hole soldering process requirements during PCB layout and assembly planning.
This component belongs to the EDAC 306 series of standard card edge connectors. The series is characterized by robust construction suitable for demanding industrial environments. The 306 series offers various position counts and mounting options, providing flexibility for different board edge connection needs while maintaining consistent electrical performance standards across the product line.
Consult the official EDAC cross-reference documentation for verified substitute part numbers. Ensure any replacement maintains identical contact spacing, row configuration, and mounting interface specifications. Validate thermal and mechanical compatibility with existing PCB designs before implementing alternative components.