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The EDAC Inc. 306-028-400-107 is a dual edge card edge connector designed for board-to-board or backplane applications. It features 56 positions with female contacts, utilizing a 0.156-inch (3.96mm) contact spacing and a 0.200-inch (5.08mm) row pitch. The connector employs a solder termination method for secure PCB mounting. It is constructed with a green insulator body and tin-plated contacts to ensure reliable signal transmission. The component operates within a temperature range of -40°C to 105°C and is currently classified as an active product in the manufacturer's portfolio.
Verify that the specific part number matches the required 56-position dual edge specification before ordering. Confirm that the operating temperature range of -40°C to 105°C aligns with the environmental conditions of the target application. Ensure compatibility with the mating card edge thickness and the soldering process used during assembly to guarantee long-term reliability.
Select this connector when a dual-sided card edge interface is required for space-constrained designs. The 0.156-inch spacing allows for higher pin counts within a limited footprint compared to wider pitch alternatives. Consider the tin plating finish for general-purpose applications where corrosion resistance is sufficient, and verify that the green insulator color meets any visual identification standards of the assembly.
This component belongs to the EDAC 306 series of edgeboard connectors, which are engineered for high-reliability electronic interconnections. The series offers various position counts and termination options to suit different board densities. As an active product, it remains available for new designs and replacement in existing manufacturing lines, supported by the manufacturer's established distribution network.
Direct substitutes must maintain identical 56-position dual edge geometry, 0.156-inch spacing, and solder termination. Verify that alternative sources provide equivalent thermal ratings and contact plating specifications to ensure functional interchangeability without redesigning the host PCB layout.