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The EDAC Inc. 306-029-400-158 is a standard card edge connector designed for dual-edge board mounting. It features 58 positions with a female contact configuration and a 0.156-inch (3.96mm) pitch. The connector utilizes tin-plated contacts on a copper alloy base, housed in a green polyamide body. It supports PCB thicknesses of 0.062 inches (1.57mm) nominal and employs a solder pin termination method. This component is rated for operation within a temperature range of -55°C to +125°C and offers an insulation resistance of 5 GOhms.
Verify the specific ordering suffix against the manufacturer's current datasheet to ensure compatibility with required plating thickness and environmental ratings. Confirm that the tin finish meets the intended application's corrosion resistance requirements. Check for any recent product change notifications regarding material substitutions or dimensional updates before finalizing procurement orders.
Select this connector when a dual-edge interface with a 0.156-inch pitch is required for standard thickness boards. Ensure the mating PCB has a nominal thickness of 0.062 inches to guarantee proper contact engagement. Consider the tin plating option if gold plating is not necessary for the specific environmental conditions. Verify that the operating temperature range aligns with the system's thermal profile.
This component belongs to the EDAC 306 series of standard card edge connectors. The series is characterized by its robust construction and suitability for general-purpose electronic applications. The 306 series provides various position counts and pitch options to accommodate different board densities and form factors within industrial and commercial hardware designs.
Direct substitutes must match the 58-position count, 0.156-inch pitch, and dual-edge female configuration. Verify that alternative parts support the same 0.062-inch PCB thickness and utilize compatible solder termination methods. Cross-reference insulation materials and operating temperature ranges to ensure equivalent performance in the target assembly.