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The EDAC Inc. 306-029-421-178 is a standard card edge connector receptacle from the 306 series, designed for through-hole mounting with a straight orientation. It features 58 positions arranged in a single row with a contact spacing of 0.156 inches (3.96 mm). The connector accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). Contacts are made of copper alloy and finished with tin plating to ensure reliable soldering and conductivity. The insulator body is constructed from thermoplastic polyester, providing structural integrity and electrical insulation.
Verify the specific ordering suffix to confirm contact plating and position count, as variations exist within the 306 series. Ensure compatibility with the target PCB thickness of 0.062 inches (1.57 mm) before integration. Confirm that the through-hole mounting style aligns with the assembly process requirements. Cross-reference the manufacturer's current datasheet to validate RoHS compliance status and environmental ratings prior to final procurement decisions.
Select this component when a single-row configuration with 0.156-inch spacing is required for high-reliability applications. The tin-plated finish offers cost-effective performance suitable for general-purpose industrial use. Consider the straight mounting angle for space-constrained vertical installations. Evaluate the thermoplastic polyester housing for adequate thermal stability within the specified operating temperature range during system design.
This part belongs to the EDAC 306 series, which specializes in card edge connectors with 0.156-inch contact spacing. The series provides various position counts and mounting options to support diverse electronic interconnect needs. The 306-029-421-178 specifically addresses applications requiring 58 positions with a single centerline row, balancing density with ease of assembly in standard manufacturing environments.
Direct substitutes within the same series include parts with identical spacing and position counts but different plating or packaging. Verify mechanical dimensions and electrical ratings against existing designs to ensure interchangeability without re-engineering the host PCB footprint.