306-029-500-104

Overview

The EDAC Inc. model 306-029-500-104 is a standard card edge connector featuring a single centerline row with 58 positions. It utilizes a contact spacing of 0.156 inches (3.96mm) and accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57mm). The component employs gold-plated copper alloy contacts terminated via solder eyelets. Designed for panel mounting, the insulator body is green polyphenylene sulfide rated for an operating temperature range from -40°C to +105°C.

Feature Summary

• Single centerline row configuration accepting 0.062 inch nominal PCB thickness
• Gold-plated copper alloy contacts with solder eyelet termination
• High-temperature polyphenylene sulfide insulator body

Applications

• Panel-mounted electronic assemblies requiring single-row card edge interfaces
• Industrial control systems utilizing 0.062 inch thick circuit boards
• Equipment operating within -40°C to +105°C environmental ranges

Procurement Notes

Verify that the specific order matches the 58-position count and 0.156-inch pitch specifications. Confirm the requirement for solder eyelet termination aligns with the assembly process. Ensure the application environment remains within the stated -40°C to +105°C operational limits. Check for any specific RoHS compliance documentation requirements relevant to the target market regulations before finalizing procurement.

Selection Notes

Select this component when a single-row interface with 0.156-inch spacing is required for 0.062-inch thick boards. The gold plating provides reliable conductivity for standard signal applications. Consider the panel mount style and solder eyelet termination method during mechanical design. Verify that the high-temperature insulation material meets the thermal demands of the specific system environment.

Part Context

This part belongs to the EDAC 306 series of edgeboard connectors. The series offers various contact terminations, mounting options, and guide solutions. The 306-029-500-104 specifically represents a 58-position variant designed for robust panel integration. It serves as a standardized interconnection solution within the broader family of high-reliability card edge components.

Replacement Considerations

Direct substitutes must match the 58-position count, 0.156-inch pitch, and single-row configuration. Verify compatibility with 0.062-inch board thickness and solder eyelet termination. Cross-reference electrical ratings and temperature specifications to ensure equivalent performance in the target application.