306-029-520-168

Overview

The EDAC Inc. 306-029-520-168 is a standard card edge connector designed for vertical panel mounting with through-hole solder termination. It features a dual-row configuration providing 36 positions with a 0.156-inch (3.96mm) contact spacing. The connector utilizes copper alloy contacts with gold plating and accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57mm). Constructed with a thermoplastic insulator, it operates within a temperature range of -40°C to +105°C and supports a current rating of 5A per contact.

Feature Summary

• Vertical panel mount design with through-hole solder termination
• Dual-row configuration accommodating 36 signal positions
• Gold-plated copper alloy contacts for reliable conductivity
• Compatible with 0.062 inch nominal thickness PCBs

Applications

• Industrial control systems requiring robust board-to-board connections
• Communication equipment interface modules
• Medical device internal connectivity solutions
• Energy management system circuit boards

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official 306 Series Ordering Guide to ensure correct pin count, row configuration, and flange options. Confirm that the target application requires the standard 0.156-inch pitch and 0.062-inch board thickness compatibility. Check RoHS compliance status if restricted substances are prohibited in the final assembly. Ensure the selected variant matches the required thermal and electrical ratings for the intended operational environment.

Selection Notes

Select this component when a vertical orientation and high-density 36-position connection are required for 0.062-inch thick substrates. The 0.156-inch pitch allows for broader trace routing compared to finer pitches. Consider the 5A current rating and 105°C operating limit for thermal management planning. Verify that the panel mounting style aligns with the mechanical enclosure design constraints.

Part Context

This part belongs to the EDAC 306 series of standard card edge connectors, which are characterized by their versatility in industrial and commercial applications. The series offers various position counts and row configurations while maintaining consistent 0.156-inch spacing. The 306-029-520-168 specifically addresses needs for dual-row connectivity with standard board thicknesses, fitting into the broader portfolio of EDAC interconnect solutions.

Replacement Considerations

Direct substitutes within the same series include parts with identical pitch and row count but different position numbers or flange styles. Cross-series replacements require matching the 0.156-inch pitch and 0.062-inch board thickness. Verify that any alternative maintains the same vertical mounting profile and through-hole termination method to ensure mechanical fit.