SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The EDAC Inc. 306-030-400-178 is a dual-edge female card edge connector designed for panel mounting applications. It features 60 positions arranged in two rows with a contact spacing of 0.156 inches (3.96 mm). The connector utilizes tin-plated contacts and a green thermoplastic insulator body. It is engineered to accept printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). The component operates within a temperature range of -40°C to +105°C and complies with RoHS3 standards.
Verify the specific ordering suffix against the manufacturer's current datasheet to confirm plating type and material specifications, as variations exist within the 306 series. Confirm that the target PCB thickness aligns with the connector's acceptance range of 0.062 inches. Ensure compliance with project-specific environmental regulations such as RoHS3 before finalizing procurement orders.
Select this model when a dual-edge female interface is required for 60-position signal routing. The 0.156-inch spacing suits standard industrial board designs. Consider the tin plating option if cost efficiency is prioritized over gold plating longevity. Verify that the panel mount style fits the chassis design constraints and that the operating temperature range meets the application's thermal requirements.
This component belongs to the EDAC 306 Series, a line of standard card edge connectors known for their versatility in various electronic assemblies. The series offers multiple position counts and spacing options to support diverse connectivity needs. The 306-030-400-178 specifically addresses high-density requirements with its 60-position dual-edge layout, serving as a critical interface between edge cards and system backplanes or panels.
Cross-reference part numbers within the EDAC 306 series for alternative configurations. Check for variants with different plating materials or position counts if exact matches are unavailable. Ensure any substitute maintains the same 0.156-inch spacing and panel mount form factor to guarantee mechanical compatibility.