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The EDAC Inc. 306-030-520-168 is a standard card edge connector featuring 30 positions with a single centerline row. It utilizes a 3.96 mm (0.156 inch) contact spacing and accepts printed circuit boards with a nominal thickness of 1.57 mm (0.062 inch). The contacts are gold-plated copper alloy, rated for 5 A current. Designed for panel mount installation in a vertical orientation, the unit employs a green thermoplastic insulator body. It operates within a temperature range of -40 °C to +105 °C and offers an insulation resistance of 5 GOhms.
Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct plating, termination style, and board thickness compatibility. Confirm that the selected variant matches the required 30-position count and vertical panel mount orientation. Cross-reference the RoHS status and material specifications with the latest datasheet to guarantee compliance with project regulatory standards before finalizing procurement orders.
Select this component when a single-row, 30-position interface is required for 1.57 mm thick circuit boards. Ensure the application environment falls within the specified -40 °C to +105 °C operating temperature range. Verify that the vertical panel mount form factor aligns with the mechanical enclosure design. Confirm that the 3.96 mm pitch meets the system's signal routing density requirements and that gold plating satisfies the electrical conductivity needs.
This part belongs to the EDAC 306 Series, which provides standard card edge connectors with 3.96 mm spacing. The series includes various configurations for different board thicknesses and mounting styles. The 306-030-520-168 specifically denotes the 30-position variant with gold-plated contacts and a green thermoplastic housing, designed for reliable vertical panel connections in industrial and commercial electronics.
Consult the official EDAC cross-reference guide for verified substitute part numbers. Ensure any replacement maintains identical 30-position count, 3.96 mm pitch, and 1.57 mm board thickness compatibility. Verify that the alternative component supports the same vertical panel mount orientation and thermal ratings.