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The EDAC Inc. 306-031-520-178 is a standard card edge connector receptacle from the 306 series. It features 31 positions with a 3.96 mm (0.156 inch) contact spacing and accepts printed circuit boards with a nominal thickness of 1.57 mm (0.062 inch). The component utilizes gold-plated copper alloy contacts for reliable signal transmission and is designed for through-hole solder termination. It employs a thermoplastic polyester insulator body, operates within a temperature range of -40°C to +105°C, and offers an insulation resistance of 5 GOhms.
Verify the specific ordering suffix against the manufacturer's current datasheet to confirm exact pin count, plating specifications, and mounting style compatibility. Ensure the target PCB thickness aligns with the 1.57 mm nominal requirement for proper insertion force and retention. Cross-reference the terminal configuration to match the intended through-hole soldering process on the assembly line.
Select this component when a single-row, 3.96 mm pitch interface is required for standard thickness boards. Consider the 306 series characteristics for applications prioritizing low profile and high durability over multi-row density. Evaluate the thermal operating range and material composition to ensure compatibility with the environmental conditions and mechanical constraints of the final product enclosure.
This part belongs to the EDAC 306 series, which specializes in standard card edge connectors. The series is characterized by its .156 inch contact spacing and compatibility with .062 inch nominal PCB thicknesses. These connectors are widely used in general-purpose electronic applications where reliable, cost-effective interconnection solutions are necessary for single-sided or double-sided edge cards.
Direct substitutes within the same series include parts like 306-015-520-178 and 306-032-520-178, which share identical pitch and board thickness specifications but differ in position count. Verify that any alternative maintains the same through-hole termination style and gold plating requirements to ensure functional equivalence.