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The EDAC Inc. 306-031-521-107 is a standard card edge connector header from the 306 series, designed for vertical panel mounting applications. It features a single row of contacts with a pitch of 3.96 mm (0.156 inches) and accommodates printed circuit boards with a nominal thickness of 1.57 mm (0.062 inches). The component utilizes copper alloy contacts plated with gold to ensure reliable signal transmission and corrosion resistance. Rated for a current capacity of 5 A, it offers an insulation resistance of 5 GOhms. The housing is constructed from thermoplastic material, providing structural integrity and electrical isolation within industrial and commercial electronic assemblies.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm contact count and termination style compatibility. Ensure that the selected variant matches the required PCB thickness tolerance of 1.57 mm. Cross-reference the RoHS compliance status with current regulatory requirements for the target market. Confirm availability through authorized distributors to guarantee authenticity and traceability of the components.
Select this connector when a single-row, vertical interface is required for 0.156-inch pitch applications. The 5 A current rating suits moderate power distribution needs alongside signal lines. Verify that the panel mounting style aligns with the mechanical enclosure design. Consider the thermoplastic housing material for general environmental protection rather than extreme thermal exposure scenarios beyond the specified operating range.
This component belongs to the EDAC 306 series of card edge connectors, which are engineered for high-reliability connections in demanding environments. The series supports various pin counts and mounting orientations, offering flexibility for diverse electronic designs. The 306-031-521-107 specifically addresses applications requiring robust vertical connectivity with standardized dimensions, ensuring compatibility with industry-standard PCB layouts and assembly processes.
Consult the official EDAC substitution guide for direct cross-references. Verify that any alternative part maintains identical pitch, board thickness acceptance, and current ratings. Ensure mechanical footprint and mounting hole patterns match the existing design to avoid retooling or layout modifications during the replacement process.