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The EDAC Inc. 306-032-521-178 is a dual-edge female card edge connector from the 306 Series, designed for board-to-board interconnection. It features 64 positions with a 0.156-inch (3.96mm) contact spacing and accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57mm). The connector utilizes cantilever contacts made of copper alloy with gold plating for reliable signal transmission. It employs a solder termination method and is housed in a green polyamide (PA66) insulator body. The component operates within a temperature range of -55°C to 85°C and is classified as a standard edgeboard connector suitable for various industrial applications.
Verify the specific ordering suffix against the manufacturer's current datasheet to confirm contact finish thickness and material composition. Ensure the selected variant matches the required PCB thickness tolerance of 0.062 inches. Confirm that the solder termination style aligns with the assembly process capabilities. Cross-reference the package quantity and lead time requirements with authorized distributors prior to purchase.
Select this connector when a dual-edge female interface with 0.156-inch spacing is required for 64-position applications. Consider the low-profile design for space-constrained assemblies. Verify compatibility with the target PCB thickness and operating temperature range. Evaluate the gold plating benefits for corrosion resistance in the intended environment compared to alternative finishes.
This component belongs to the EDAC 306 Series, which offers standardized card edge connectors with 0.156-inch spacing. The series provides various position counts and mounting options for diverse interconnection needs. EDAC designs these connectors to meet rigorous quality standards for industrial and commercial use, ensuring consistent performance across different application scenarios.
Consult official EDAC documentation for direct cross-references or updated part numbers within the 306 Series. Verify dimensional compatibility and electrical specifications before substituting with generic equivalents.