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The EDAC Inc. 306-033-420-107 is a standard card edge connector from the 306 series, designed as a dual female receptacle with 66 positions. It features a contact spacing of 0.156 inches (3.96 mm) and accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). The connector utilizes copper alloy contacts with gold plating to ensure reliable signal transmission. Rated for 5 A current, it offers an insulation resistance of 5 Gohms. The housing is constructed from thermoplastic polyester, providing durability for panel mount vertical installations.
Verify the specific suffix codes against official EDAC documentation to confirm exact pin count and termination style compatibility. Ensure that the ordering information matches the required 66-position configuration and 3.96 mm pitch specifications. Confirm that the thermoplastic polyester housing material meets the environmental requirements for the intended application environment before finalizing procurement orders.
Select this component when a dual female receptacle with 66 positions is required for vertical panel mounting applications. The 3.96 mm pitch and 0.062 inch board thickness compatibility are critical constraints for PCB design integration. Consider the 5 A current rating and gold-plated contacts for applications demanding stable electrical performance in industrial or telecommunications environments.
This part belongs to the EDAC 306 series of standard card edge connectors, which are widely used in various electronic industries. The series offers multiple position counts and termination options to suit different board interface needs. The 306-033-420-107 specifically represents a high-density option within this family, providing a reliable connection solution for complex electronic assemblies requiring standardized form factors.
Cross-reference with EDAC part number 306-033-521-107 for potential alternative configurations within the same series. Verify mechanical dimensions and electrical ratings against any proposed substitute components to ensure functional equivalence in the target assembly.