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The EDAC Inc. 306-034-420-102 is a standard card edge connector receptacle featuring 68 positions arranged in a dual-row configuration. It utilizes a 3.96 mm (0.156 inch) contact spacing and is designed for .062 inch (1.57 mm) nominal thickness printed circuit boards. The connector employs gold-plated copper alloy contacts with a tin-plated termination interface, supporting a current rating of 5 A. It offers vertical panel mount installation and operates within a temperature range of -40°C to 105°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm contact plating, row configuration, and termination type. Ensure the selected variant matches the required board thickness and current carrying capacity for the target application environment. Cross-reference the component number with authorized distributors to confirm availability and authenticity before finalizing procurement orders.
Select this component when a high-density connection with 68 positions is required for double-sided PCBs. The 3.96 mm pitch suits applications needing robust mechanical retention with vertical panel mounting. Verify that the operating temperature range meets environmental demands and that the gold contact plating aligns with signal integrity requirements for the specific electronic signals being transmitted.
This part belongs to the EDAC 306 series of standard card edge connectors, which provide extensive design flexibility for various interconnect needs. The series supports multiple position counts and configurations, allowing designers to tailor solutions to specific layout constraints. As a receptacle, it mates with corresponding card edge headers or directly with PCB edges, forming a critical link in modular electronic systems requiring reliable data and power transfer.
Direct substitutes include other EDAC 306 series variants with matching 68-position dual-row specifications and identical 3.96 mm pitch. Ensure any replacement maintains the same vertical panel mount orientation and gold contact plating to preserve electrical performance and mechanical fit without requiring redesign of the host enclosure or PCB footprint.