306-035-521-104

Overview

The EDAC Inc. 306-035-521-104 is a dual-edge card edge connector designed for panel mount applications. It features 35 positions with a 0.156-inch (3.96mm) pitch and accepts printed circuit boards with a nominal thickness of 0.062 inches. The contacts are constructed from copper alloy with a gold finish, providing reliable signal transmission. Termination is achieved via solder through-hole mounting, ensuring secure attachment to the host board.

Feature Summary

• Dual-edge contact configuration for robust board interface
• Gold-plated cantilever contacts ensure durability and conductivity
• Panel mount design facilitates secure installation in enclosures

Applications

• Industrial control systems requiring durable interconnects
• Communication equipment backplanes
• Consumer electronics assembly

Procurement Notes

Verify that the required PCB thickness matches the 0.062-inch specification to ensure proper contact engagement. Confirm that the panel mount style aligns with the mechanical constraints of the target enclosure. Ensure soldering processes are compatible with the gold contact finish to maintain electrical integrity during assembly.

Selection Notes

Select this component when a dual-edge connection is required for a 35-position interface. The 0.156-inch pitch dictates the trace spacing on the mating card. Consider the vertical mounting orientation and panel mount style as critical factors for mechanical integration within the system architecture.

Part Context

This part belongs to the EDAC 306 series of card edge connectors. The series is characterized by low-profile insulator bodies and standardized contact spacing. The specific model number indicates the position count, row configuration, and termination method within the broader product family.

Replacement Considerations

Consult official EDAC documentation for direct substitutes within the 306 series. Verify compatibility regarding pitch, row count, and termination style before considering alternative manufacturers.