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The EDAC Inc. 306-036-520-112 is a standard card edge connector from the 306 series, designed for vertical panel mounting applications. It features a dual female configuration with 72 positions and a contact spacing of 0.156 inches (3.96 mm). The connector accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). Contacts are gold-plated copper alloy, rated for 5 A current, with an insulation resistance of 5 Gohms. The housing is constructed from thermoplastic material.
Verify the complete part number including suffixes to ensure correct contact plating and housing color specifications. Confirm that the target application supports the specified 3.96 mm pitch and 1.57 mm board thickness. Check RoHS compliance status against current regulatory requirements for the destination market. Ensure panel mounting hardware compatibility with the vertical installation style before finalizing procurement orders.
Select this component when a dual-edge interface with 72 positions is required for vertical panel integration. The 3.96 mm spacing accommodates specific PCB trace layouts, while the 5 A rating suits moderate power applications. Verify that the thermoplastic housing meets environmental temperature constraints. Consider the low-profile body height if space limitations exist within the enclosure design.
This connector belongs to the EDAC 306 series, which provides standardized card edge solutions for various electronic assemblies. The series offers multiple position counts and mounting styles to support diverse design needs. The 306-036-520-112 variant specifically addresses applications requiring a high-density dual-edge connection with vertical orientation for stable mechanical performance.
Direct substitutes within the same series include 306-036-520-102 and 306-036-520-112 variations with different housing colors. Cross-series replacements require matching the 3.96 mm pitch and 72-position count. Verify that alternative parts support the same 1.57 mm board thickness and vertical mounting angle.