307-007-459-178

Overview

The EDAC Inc. 307-007-459-178 is a single-row card edge connector receptacle featuring seven positions with a 0.156-inch (3.96 mm) contact pitch. Designed for through-hole panel mounting at a right angle, it utilizes tin-plated copper alloy contacts and a green thermoplastic insulator body. The component accommodates printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). It operates within a temperature range of -40°C to +105°C and complies with RoHS3 standards.

Feature Summary

• Single-row configuration with seven positions for standard card edge applications
• Through-hole solder lug termination ensures secure PCB attachment
• Right-angle panel mount design facilitates space-efficient integration
• Tin-plated contacts provide reliable signal transmission

Applications

• Industrial control system interconnects
• Telecommunications equipment backplanes
• Consumer electronic device interfaces
• Medical instrumentation modules

Procurement Notes

Verify the specific ordering suffix against official EDAC documentation to confirm plating type and material specifications. Ensure compatibility with target board thickness and mounting requirements before procurement. Confirm regional availability and compliance certifications such as RoHS3 status directly with authorized distributors or the manufacturer.

Selection Notes

Select this component when a single-row, seven-position connection is required with right-angle panel mounting. The 0.156-inch pitch suits standard half-pitch applications. Verify that the tin plating meets environmental or conductivity requirements compared to gold alternatives. Ensure the 0.062-inch board thickness tolerance aligns with the design constraints.

Part Context

This part belongs to the EDAC 307 series, which offers various configurations for card edge connections. The series provides options for different row counts, pitches, and mounting styles. The 307-007-459-178 specifically addresses needs for low-pin-count, right-angle interface solutions in compact electronic assemblies.

Replacement Considerations

Cross-reference with other EDAC 307 series parts for pin count and pitch variations. Verify mechanical dimensions and electrical ratings against alternative suppliers' components to ensure functional equivalence without redesigning the host PCB footprint.