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The EDAC Inc. 307-007-505-107 is a standard card edge connector from the 307 series, designed for reliable signal transmission in electronic assemblies. It features 7 positions with a 3.96 mm (0.156 inch) pitch and supports single-row female contacts. The unit utilizes gold-plated copper alloy terminals for enhanced conductivity and corrosion resistance. Designed for panel mounting at a vertical angle, it accommodates PCB thicknesses ranging from 1.37 mm to 1.78 mm. The connector operates within a temperature range of -40°C to +105°C and includes a green thermoplastic polyester insulator.
Verify the complete part number including suffix codes to confirm specific plating thickness and contact configuration. Confirm RoHS compliance status against current regulatory requirements for your target market. Ensure that the mating card edge thickness falls within the specified mechanical tolerance range to prevent connection failure or mechanical stress during assembly and operation.
Select this component when a single-row, vertically mounted card edge interface is required for panel integration. Consider the 3.96 mm pitch and 7-position count for circuit density needs. Verify that the operating temperature range meets environmental conditions. Compare against other 307 series variants if different row counts or mounting styles are necessary for the specific application layout.
This connector belongs to the EDAC 307 series, which offers a range of standard card edge solutions. The series typically includes various position counts and mounting configurations to support diverse electronic design requirements. The 307-007 variant specifically addresses applications needing a compact, seven-channel vertical interface with robust thermal and electrical characteristics.
Direct substitutes within the EDAC 307 series may include models with identical pitch and position counts but different mounting styles or plating options. Cross-brand replacements require matching pitch, current rating, and mechanical dimensions. Verify compatibility with existing PCB footprints and mating card specifications before substitution.