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307-008-405-104 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FML 8POS 0.156 TIN. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 307-008-405-104 is a standard card edge connector receptacle featuring 8 positions in a single row configuration. It utilizes a 3.96 mm (0.156 inch) pitch and is designed for PCB mounting with solder terminals. The contacts are constructed from copper alloy with tin plating, rated for 5 A current. The insulator is green thermoplastic polyester, accommodating board thicknesses of 1.37 mm to 1.78 mm. Operating temperature ranges from -40°C to +105°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm terminal plating and orientation requirements. Ensure the target printed circuit board thickness falls within the specified 1.37 mm to 1.78 mm range for proper mechanical engagement. Confirm RoHS compliance status matches project environmental regulations before finalizing procurement orders.
Select this component when a single-row, low-profile connection is required for modules with a 3.96 mm pitch. The tin-plated contacts offer cost-effective conductivity suitable for general-purpose applications. Consider the vertical or right-angle mounting style options available within the 307 series if space constraints dictate specific installation orientations on the host board.
This part belongs to the EDAC 307 series of standard card edge connectors. The series offers various position counts and mounting styles to support diverse electronic assembly needs. Components in this family share common dimensional standards and material specifications, ensuring compatibility across different product lines manufactured by EDAC Inc.
Cross-reference the 307-008-405-104 with other EDAC 307 series variants that maintain identical 8-position, single-row geometry. Verify that any substitute part preserves the 3.96 mm pitch and compatible board thickness specifications to ensure mechanical fit without redesigning the host enclosure.
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