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307-019-405-168 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FML 19POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 307-019-405-168 is a standard card edge connector from the 307 series, designed for single-edge board applications. It features 19 positions with a 0.156-inch (3.96 mm) pitch and utilizes tin-plated copper alloy contacts. The housing is green thermoplastic polyester, rated for operation between -40°C and +105°C. This female connector supports non-specified double-sided cards and employs a solder termination method for secure panel mounting.
Verify the specific ordering suffix to confirm contact plating and termination style, as variations exist within the 307 series. Ensure compatibility with the target PCB thickness range of 0.054 to 0.070 inches. Confirm that the tin finish meets environmental requirements if gold plating is not specified. Check RoHS compliance status against current project regulations before finalizing procurement orders.
Select this component when a single-edge connection is required for 19-position circuits. The 3.96 mm pitch accommodates standard board layouts. Tin plating offers cost-effectiveness compared to gold. Verify that the right-angle or vertical mounting orientation matches the enclosure design. Ensure the operating temperature range suits the intended environment.
This part belongs to the EDAC 307 series of card edge connectors, which provides various position counts and mounting styles. The series is widely used in industrial and commercial applications requiring robust board-to-board or board-to-panel connections. The 307 series emphasizes durability and standardized dimensions for easy integration into existing systems.
Compatible substitutes include other 307 series variants with matching 19-position counts and 3.96 mm pitch. Verify that replacement parts maintain the same single-edge female configuration and tin-plated contact finish. Ensure dimensional compatibility with the host PCB and enclosure constraints.
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