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307-022-520-258 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 22POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 307-022-520-258 is a standard card edge connector receptacle featuring 22 positions with a 3.96 mm pitch. Designed for PCB mount applications, it utilizes gold plating on the mating area and tin plating on tails with nickel underplating. The component supports a current rating of 5 amps and operates within a temperature range of -40°C to +105°C. It accommodates board thicknesses between 1.37 mm and 1.78 mm, ensuring reliable electrical connectivity in dual-row configurations.
Verify that the specific ordering suffix matches the required plating configuration, as variations exist within the series. Confirm compatibility with the target PCB stack-up thickness, specifically the 1.37 mm to 1.78 mm range. Ensure the procurement channel provides original manufacturer documentation to validate RoHS compliance and material specifications before finalizing acquisition.
Select this component when a 22-position dual-row interface is required with a 3.96 mm spacing. Consider the 5 amp current rating and -40°C to +105°C operating range against environmental demands. Evaluate the straight panel mount orientation and solder termination method against the mechanical assembly constraints of the printed circuit board design.
This part belongs to the EDAC 307 series, which defines a family of standard card edge connectors. The series offers various position counts and mounting styles, all sharing consistent dimensional standards and material properties. This specific model represents a mid-range position count variant designed for general-purpose high-reliability interconnect applications.
Cross-reference compatible parts within the same 307 series family, such as 307-022-527-104 or 307-022-521-102, if pin counts or termination types differ. Verify that substitute components maintain identical pitch, board thickness tolerance, and current ratings to ensure functional equivalence without redesigning the host PCB footprint.
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