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307-026-422-212 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 26POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 307-026-422-212 is a standard card edge connector from the 307 series, designed for panel mount applications with a right-angle orientation. It features 26 positions with a contact spacing of 3.96 mm and accommodates a PCB thickness of 1.57 mm. The connector utilizes gold-plated copper alloy contacts rated for 5 A current and offers an insulation resistance of 5 GOhms. Constructed with a thermoplastic (TP) housing, it supports vertical or angled mounting configurations within its series design.
Verify specific ordering suffixes against official EDAC documentation to confirm exact pin count, plating type, and mounting style. Confirm RoHS compliance status and lead times directly with authorized distributors, as availability varies by region. Ensure the selected variant matches the required PCB thickness and current rating specifications for the target application environment.
Select this component when a 26-position card edge interface with 3.96 mm spacing is required for panel mounting. Verify that the host PCB maintains the specified 1.57 mm nominal thickness to ensure proper contact engagement. Consider the right-angle orientation for space-constrained enclosures where vertical board insertion is necessary alongside existing panel structures.
This part belongs to the EDAC 307 Series of standard card edge connectors, characterized by 3.96 mm contact spacing and 5.08 mm row spacing. The series provides various position counts and mounting styles, including headers and receptacles, suitable for diverse industrial and commercial electronic packaging needs requiring robust mechanical retention.
Cross-reference with other EDAC 307 series variants such as 307-026-420-212 or 307-026-424-212 for similar 26-position configurations. Ensure substitute parts match the critical parameters of 3.96 mm pitch, 1.57 mm board thickness, and compatible mounting orientation before implementation.
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