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307-030-542-268 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 30POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 307-030-542-268 is a standard card edge connector from the 307 series, designed for dual-row applications with 30 positions. It features a contact spacing of 3.96 mm and a row spacing of 5.08 mm. The component accepts printed circuit boards with a nominal thickness of 1.57 mm. Termination is achieved via wire wrap methods, utilizing copper alloy contacts with a gold finish. The insulator body is constructed from thermoplastic material, providing a low-profile design suitable for panel mounting configurations.
Verify the specific termination style and row count against project schematics, as the 307 series includes both single and dual-row variants with different suffixes. Confirm that the wire wrap termination matches the available PCB pad or header layout. Ensure the 1.57 mm board thickness compatibility aligns with the manufactured circuit board specifications to guarantee proper mechanical fit and electrical engagement.
Select this part when a dual-row card edge interface with wire wrap termination is required. The 3.96 mm pitch and 5.08 mm row spacing define the mechanical footprint. Verify that the application environment supports the operating temperature range and that the gold contact finish meets corrosion resistance needs. Compare against single-row alternatives if space constraints differ from the dual-row form factor.
This component belongs to the EDAC 307 series of standard card edge connectors. The series offers various position counts and termination styles, including solder and wire wrap options. The 307-030-542-268 specifically denotes a 30-position dual-row variant. The series is characterized by its robust thermoplastic housing and consistent 3.96 mm contact spacing across models.
Direct substitutes within the EDAC 307 series must match the 30-position count, dual-row configuration, and wire wrap termination. Variants with different suffixes may offer single-row layouts or solder terminations, which are not functionally equivalent. Cross-manufacturer replacements require matching the 3.96 mm pitch and 1.57 mm board thickness constraints.
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