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310-11-133-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 33POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 310-11-133-41-001000 is a single-row IC socket designed for through-hole mounting. It features 13 positions with a 0.100-inch (2.54mm) contact pitch and 0.100-inch row spacing. The contacts are gold-plated copper alloy, offering a mating surface thickness of 30.0µin and a column thickness of 10.0µin. Rated for 3A current and 100V/150VDC voltage, it operates within a -55°C to 125°C range. The housing is black PCT polyester, UL94 V-0 rated, with a solder tail termination type.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm contact plating thickness and material composition. Ensure the selected variant matches the required row spacing and pin count for the target PCB footprint. Confirm RoHS compliance status if environmental regulations apply to the end product.
Select this component when a single-row, through-hole IC socket with gold-plated contacts is required. The 0.100-inch pitch suits standard DIP packages. Consider the thermal rating and voltage limits for the specific application environment. Verify that the solder tail length accommodates the board thickness and manufacturing process.
This part belongs to the Mill-Max 310 series of interconnect sockets. The series offers various configurations for different pin counts and row arrangements. Mill-Max Manufacturing Corp. specializes in high-reliability interconnect components, producing millions of units weekly for diverse industrial applications.
Public confirmed substitute part numbers are not available in the provided documentation. Cross-reference with other single-row 13-position DIP sockets only if electrical parameters and physical dimensions match exactly.
The contact material is copper alloy.
Yes, the 0.100-inch (2.54mm) pitch is standard for dual in-line package configurations.
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