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310-13-119-61-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 19POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max Manufacturing Corp. model 310-13-119-61-001000 is a precision IC socket designed for through-hole mounting on printed circuit boards. This component features a dual in-line package configuration with 19 positions arranged in a 2x19 grid, providing reliable electrical connectivity for integrated circuits. The connector utilizes gold-plated contacts to ensure low contact resistance and high corrosion resistance over extended operational lifecycles. It is engineered to withstand operating temperatures ranging from -55°C to 125°C, ensuring stability in demanding electronic environments.
Verify the specific pin count and row configuration against the target PCB footprint before ordering. Confirm that the supplier provides official datasheets matching the exact suffix to ensure compatibility with standard DIP packages. Check for RoHS compliance documentation if environmental regulations apply to the end product. Ensure storage conditions maintain contact integrity prior to installation.
Select this component when a robust, solderable socket is required for permanent or semi-permanent circuit board installations. Consider the thermal rating and mechanical durability compared to surface-mount alternatives. Evaluate the available contact plating thickness requirements for the specific signal integrity needs of the application. Ensure the physical dimensions align with the enclosure constraints of the final device design.
This part belongs to the Mill-Max 310 series of IC sockets, which are characterized by their through-hole mounting style and open-frame design. The series offers various position counts to accommodate different integrated circuit package sizes. These components are widely used in scenarios requiring reliable, repeatable mating cycles without compromising the structural integrity of the host circuit board.
Direct substitutes must match the 19-position (2x19) grid, 0.100-inch pitch, and through-hole termination type. Verify that alternative manufacturers offer equivalent gold plating specifications and temperature ratings. Ensure the housing material and mechanical retention features are compatible with the existing assembly process.
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