310-13-131-61-001000

Description：CONN RCPT 31POS 0.1 GOLD PCB
Series：310
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk

SKU:d7565c473d60 Category: Headers, Receptacles, Female Sockets Brand: Mill-Max Manufacturing Corp.

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Product introduction

310-13-131-61-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 31POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.

Headers, Receptacles, Female Sockets specifications for 310-13-131-61-001000

Description：CONN RCPT 31POS 0.1 GOLD PCB
Series：310
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk
Connector Type：Receptacle
Contact Type：Female Socket
Style：Board to Board
Number of Positions：31
Number of Positions Loaded：All
Pitch - Mating：0.100" (2.54mm)
Number of Rows：1
Row Spacing - Mating：-
Mounting Type：Through Hole
Termination：Solder
Fastening Type：Push-Pull
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：30.0µin (0.76µm)
Insulation Color：Black
Insulation Height：0.110" (2.79mm)
Contact Length - Post：0.125" (3.18mm)
Operating Temperature：-55°C ~ 125°C
Material Flammability Rating：UL94 V-0
Contact Finish - Post：Gold
Mated Stacking Heights：-
Ingress Protection：-
Features：-
Current Rating (Amps)：3A
Voltage Rating：100V, 150VDC

Headers, Receptacles, Female Sockets datasheet and documents for 310-13-131-61-001000

310-13-131-61-001000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 310-13-131-61-001000 is a precision IC socket designed for dual in-line package (DIP) integration. It features 31 positions arranged in a 2x15 grid with a standard 0.100-inch (2.54mm) contact spacing. The component utilizes through-hole termination for secure board mounting and employs gold-plated contacts to ensure reliable signal transmission. This specific model belongs to the 0310 series, engineered for high-reliability interconnect applications requiring durable mechanical engagement and consistent electrical performance across operational environments.

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