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310-44-111-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 11POS 0.1 TIN PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 310-44-111-41-001000 is a standard solder tail IC socket designed for through-hole mounting. It features an open-frame construction with 11 positions arranged in a single row (1 x 11). The connector utilizes a 0.100 inch (2.54 mm) contact spacing to accommodate standard DIP packages. Contact surfaces are plated with gold over nickel to ensure reliable signal transmission and corrosion resistance. The unit is rated for operation within a temperature range of -55°C to +125°C, supporting robust electronic assembly requirements.
Verify the specific pin count and row configuration against the target PCB footprint before ordering. Confirm that the solder tail length matches the board thickness and plating specifications align with environmental exposure requirements. Cross-reference the manufacturer datasheet for mechanical dimensions to ensure compatibility with existing enclosure constraints and assembly tools.
Select this component when a single-row DIP socket with solder tail termination is required. Ensure the application does not demand surface mount technology or high-current capabilities beyond standard signal levels. Consider the operating temperature range and contact material suitability for the specific environmental conditions of the final product deployment.
This part belongs to the Mill-Max 310 series of interconnect sockets. The series offers various configurations for standard and custom IC applications. These components are engineered for high reliability in precision-machined interconnect solutions, serving as critical interfaces between integrated circuits and printed circuit boards in diverse electronic systems.
Consult official Mill-Max documentation for verified substitute part numbers. Generic equivalents may differ in contact geometry, plating thickness, or mechanical retention properties. Validate any alternative component against the original specifications to maintain system integrity and compliance.
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