310-47-138-41-001000

$11.66

Description：CONN RCPT 38POS 0.1 GOLD PCB
Series：310
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk

SKU:69eb4f19da0e Category: Headers, Receptacles, Female Sockets Brand: Mill-Max Manufacturing Corp.

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Product introduction

310-47-138-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 38POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.

Headers, Receptacles, Female Sockets specifications for 310-47-138-41-001000

Description：CONN RCPT 38POS 0.1 GOLD PCB
Series：310
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk
Connector Type：Receptacle
Contact Type：Female Socket
Style：Board to Board
Number of Positions：38
Number of Positions Loaded：All
Pitch - Mating：0.100" (2.54mm)
Number of Rows：1
Row Spacing - Mating：-
Mounting Type：Through Hole
Termination：Solder
Fastening Type：Push-Pull
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：Flash
Insulation Color：Black
Insulation Height：0.110" (2.79mm)
Contact Length - Post：0.125" (3.18mm)
Operating Temperature：-55°C ~ 125°C
Material Flammability Rating：UL94 V-0
Contact Finish - Post：Tin
Mated Stacking Heights：-
Ingress Protection：-
Features：-
Current Rating (Amps)：3A
Voltage Rating：100V, 150VDC

Headers, Receptacles, Female Sockets datasheet and documents for 310-47-138-41-001000

310-47-138-41-001000

Headers, Receptacles, Female Sockets Overview

The Mill-Max Manufacturing Corp. model 310-47-138-41-001000 is a single in-line package (SIP) IC socket designed for through-hole mounting. It features 38 positions arranged in a single row with a 0.100-inch (2.54mm) contact spacing. The component utilizes solder tail termination and gold-plated contacts to ensure reliable electrical connections. Constructed with a PCT polymer housing, it supports a wide operating temperature range from -55°C to +125°C and is rated for 3A current. This open-frame design facilitates easy insertion and removal of integrated circuits while maintaining mechanical stability during operation.

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