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310-87-118-41-105101 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Preci-Dip. Its product description is CONN SOCKET 18POS 0.1 GOLD SMD. Review the specifications below when checking this part for your BOM.
The Preci-Dip 310-87-118-41-105101 is a surface-mount IC DIP socket featuring 18 positions arranged in a 2x9 configuration. It utilizes a 0.100-inch (2.54mm) contact pitch and a 0.3-inch (7.62mm) row spacing to accommodate dual-in-line packages. The connector employs gold-plated beryllium copper contacts for the mating interface, ensuring reliable signal transmission, while tin-plated brass posts facilitate soldering to the printed circuit board. Designed for through-hole or surface-mount integration, it operates within a temperature range of -55°C to 125°C and meets UL94 V-0 flammability standards.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm exact plating thickness and termination style. Ensure compatibility with the target DIP package dimensions regarding row spacing and pin count. Confirm RoHS compliance status if required by project specifications. Cross-reference the part number with authorized distributors to validate current availability and lead times before finalizing procurement plans.
Select this component when a low-profile surface-mount solution is required for 18-pin DIP devices. Consider the mechanical stability provided by the surface-mount footprint compared to traditional through-hole variants. Evaluate the thermal performance capabilities relative to the operating environment constraints. Ensure the open-frame structure aligns with spatial limitations on the target circuit board layout.
This component belongs to the Preci-Dip 310 series, which specializes in rectangular connectors and sockets. The 310-87 variant specifically targets DIP socket applications, offering a balance between mechanical robustness and electrical reliability. It serves as a critical interconnect element in electronic assemblies where standardized DIP footprints are utilized for memory, logic, or microcontroller components.
Consult the official Preci-Dip cross-reference guide for verified substitute part numbers. Ensure any alternative maintains identical pin count, pitch, and row spacing specifications. Verify that replacement options match the original termination style and mounting orientation requirements.
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