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310-87-130-41-105101 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Preci-Dip. Its product description is CONN SOCKET 30POS 0.1 GOLD SMD. Review the specifications below when checking this part for your BOM.
The Preci-Dip 310-87-130-41-105101 is a surface-mount IC DIP socket featuring 10 positions arranged in a 2x5 configuration. It utilizes a 0.100-inch (2.54mm) contact pitch and a 0.3-inch (7.62mm) row spacing. The connector employs gold-plated beryllium copper contacts with tin-plated brass termination pins, rated for 1A current at 10mΩ contact resistance. Constructed from UL94 V-0 rated PCT insulation, it supports solder tail termination and operates within a temperature range of -55°C to 125°C.
Verify the specific suffix codes against official manufacturer documentation to confirm exact plating thickness and material specifications. Ensure that ordering requirements align with the precise surface-mount package dimensions and thermal characteristics defined in the component datasheet. Cross-reference part numbers to avoid substitution errors.
Select this component when surface-mount technology is required for DIP-style integration without through-hole drilling. Evaluate the open-frame structure for accessibility needs and verify that the 1A current rating meets the application's electrical load requirements. Confirm compatibility with automated placement equipment based on the package geometry.
This component belongs to the Preci-Dip 310 series, which specializes in high-density interconnect solutions. The series offers various position counts and termination styles tailored for modern electronics manufacturing. The 310-87 variant specifically addresses the need for compact, reliable sockets in space-constrained surface-mount designs.
Consult official manufacturer cross-reference lists for verified substitutes. Generic equivalents may differ in contact material or plating thickness, potentially affecting long-term reliability and electrical performance in critical applications.
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