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310-87-131-41-105101 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Preci-Dip. Its product description is CONN SOCKET 31POS 0.1 GOLD SMD. Review the specifications below when checking this part for your BOM.
The Preci-Dip 310-87-131-41-105101 is a surface mount socket connector featuring 31 positions arranged in a single row. It utilizes a 0.100 inch (2.54mm) mating pitch and accepts pins with a 0.100 inch column spacing. The housing is constructed from black, glass-reinforced PCT polyester rated UL94 V-0. Contacts are made of beryllium copper with gold plating on the mating interface and tin plating on the termination posts. Designed for wave soldering, it supports a current rating of 3A and operates within a temperature range of -55°C to +125°C.
Verify the specific ordering suffix against manufacturer documentation to confirm exact contact plating thickness and termination style. Ensure compatibility with standard reflow or wave soldering profiles defined in the official datasheet. Confirm that the selected variant matches the required pin count and row configuration for the target application layout.
Select this component when a low-profile, single-row socket is required for surface mount applications. Consider the 31-position capacity and 2.54mm pitch for space-constrained designs. Evaluate the thermal endurance limits and material flammability ratings against environmental operating conditions before finalizing the bill of materials.
This part belongs to the Preci-Dip 310 series of rectangular connectors. The series offers various configurations including through-hole and surface mount options with different pin counts. The 310-87 designation specifically indicates a socket type with surface mount termination capabilities.
Direct substitutes include other 31-position, 2.54mm pitch surface mount sockets from compatible manufacturers. Verify mechanical dimensions, contact material specifications, and plating requirements to ensure functional equivalence without redesigning the footprint.
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