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310-91-140-61-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 40POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 310-91-140-61-001000 is a 20-position IC and component socket designed for board-to-board applications. It features a 0.100 inch (2.54mm) pitch with through-hole termination. The connector utilizes push-pull fastening for secure attachment without tools. Contact surfaces are gold-plated copper alloy, ensuring reliable signal transmission. The unit operates within a temperature range of -55°C to 125°C and is constructed from PCT polyester insulation.
Verify the specific ordering suffix against the manufacturer's current catalog to confirm exact pin count and termination style. Confirm RoHS compliance status directly with the supplier, as availability may vary by region. Request updated datasheets to ensure alignment with latest manufacturing specifications before finalizing procurement orders.
Select this component when a robust, tool-free connection method is required for 20-pin DIP configurations. The push-pull design offers superior field serviceability compared to fixed sockets. Ensure the application environment falls within the specified operating temperature range and that the 0.100-inch pitch matches the target PCB layout requirements.
This part belongs to the Mill-Max 310 series of standard pin headers and sockets. The series provides versatile interconnect solutions for various electronic assembly needs. The 310-91 variant specifically denotes a receptacle configuration suitable for mating with corresponding header pins or IC packages.
Compatible substitutes include other 20-position DIP sockets with identical 0.100-inch pitch and through-hole termination. Verify that alternative parts support the same push-pull fastening mechanism if tool-free maintenance is a critical requirement. Cross-reference physical dimensions to ensure compatibility with existing enclosure constraints.
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