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310-99-115-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 15POS 0.1 TIN-LEAD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 310-99-115-41-001000 is an IC and component socket designed for through-hole mounting. It features a single row of 15 positions with a 0.100 inch (2.54 mm) pin spacing. The connector utilizes gold-plated contacts on both the mating and termination interfaces to ensure reliable signal transmission. It is rated for operation within a temperature range of -55°C to 125°C, supporting standard industrial environmental conditions.
Verify the specific contact plating thickness and insulation material composition against the official Mill-Max datasheet prior to integration. Confirm that the through-hole footprint matches the target PCB design guidelines. Ensure the operating temperature range aligns with the system's environmental requirements to prevent performance degradation during service life.
Select this component when a single-row, 15-position socket is required for through-hole applications. Consider the gold plating for durability and the specific pin spacing compatibility with the target integrated circuits. Evaluate the mechanical stability provided by the through-hole termination against surface-mount alternatives for vibration-prone environments.
This part belongs to the Mill-Max 310 series of interconnect sockets. The series is characterized by precision-machined components designed for high reliability. The manufacturer emphasizes US-based production to maintain quality standards. This specific model represents a standard configuration within their broader portfolio of IC and component sockets.
Consult the official Mill-Max catalog for direct cross-references. Verify pin count, row configuration, and spacing dimensions before substituting. Generic equivalents may lack the specific plating or material specifications required for high-reliability applications.
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