310-99-149-41-001000

$11.11

Description：CONN RCPT 49POS 0.1 TIN-LEAD PCB
Series：310
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk

SKU:1d0d69b262e8 Category: Headers, Receptacles, Female Sockets Brand: Mill-Max Manufacturing Corp.

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Product introduction

310-99-149-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 49POS 0.1 TIN-LEAD PCB. Review the specifications below when checking this part for your BOM.

Headers, Receptacles, Female Sockets specifications for 310-99-149-41-001000

Description：CONN RCPT 49POS 0.1 TIN-LEAD PCB
Series：310
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk
Connector Type：Receptacle
Contact Type：Female Socket
Style：Board to Board
Number of Positions：49
Number of Positions Loaded：All
Pitch - Mating：0.100" (2.54mm)
Number of Rows：1
Row Spacing - Mating：-
Mounting Type：Through Hole
Termination：Solder
Fastening Type：Push-Pull
Contact Finish - Mating：Tin-Lead
Contact Finish Thickness - Mating：100.0µin (2.54µm)
Insulation Color：Black
Insulation Height：0.110" (2.79mm)
Contact Length - Post：0.125" (3.18mm)
Operating Temperature：-55°C ~ 125°C
Material Flammability Rating：UL94 V-0
Contact Finish - Post：Tin-Lead
Mated Stacking Heights：-
Ingress Protection：-
Features：-
Current Rating (Amps)：3A
Voltage Rating：100V, 150VDC

Headers, Receptacles, Female Sockets datasheet and documents for 310-99-149-41-001000

310-99-149-41-001000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 310-99-149-41-001000 is a through-hole IC socket receptacle featuring 49 positions arranged in a single row. It utilizes a 0.100-inch (2.54mm) pin spacing and accepts tin-lead plated contacts. Designed for board-to-board stacking, the unit operates within a temperature range of -55°C to 125°C and employs a push-pull fastening mechanism.

Headers, Receptacles, Female Sockets Feature Summary

Push-pull fastening mechanism for secure retention
Board-to-board stacking capability
Tin-lead contact plating for reliable interconnection

Headers, Receptacles, Female Sockets Applications

IC component sockets
Interconnect applications
Board-to-board stacking

Headers, Receptacles, Female Sockets Procurement Notes

Verify that the specific tin-lead contact plating meets your assembly process requirements, particularly regarding lead-free compliance standards if applicable. Confirm that the 49-position single-row configuration aligns with your PCB footprint design. Ensure the push-pull mounting style is compatible with your enclosure constraints. Cross-reference the datasheet for precise mechanical dimensions to avoid clearance issues during installation.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a high-density single-row socket is required for direct board stacking. The push-pull feature simplifies insertion and removal compared to standard friction-fit sockets. Consider the tin-lead finish if solderability or specific environmental conditions favor this plating over gold. Verify that the 0.100-inch pitch matches the mating connector or IC package specifications exactly.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Mill-Max 310 series of IC and component sockets. These connectors are engineered for high-reliability interconnect solutions in demanding environments. The series offers various position counts and plating options to suit different electrical and mechanical requirements.