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311-83-111-41-001101 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Preci-Dip. Its product description is CONN SOCKET 11POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Preci-Dip 311-83-111-41-001101 is a 11-position board-to-board socket connector designed for through-hole mounting. It features a single row with a 0.100-inch (2.54mm) mating pitch and utilizes gold-plated contacts to ensure reliable signal transmission. The unit incorporates a push-pull locking mechanism for secure attachment between circuit boards. Constructed with black PCT insulation rated UL94 V-0, it supports a wide operating temperature range from -55°C to 125°C. The connector is rated for 3A current and offers high durability for repeated insertion cycles.
Verify the specific pin count matches the design requirement of 11 positions before ordering. Confirm that the PCB footprint aligns with the 0.100-inch pitch specification. Ensure the assembly process accommodates the through-hole soldering method and the required clearance for the push-pull locking tabs. Check material certifications if environmental compliance is mandatory for the target application.
Select this component when a secure, non-screw locking interface is required for vertical board stacking. The 3A rating suits moderate power applications alongside signal lines. Consider the 0.161-inch insulation height for stack-up constraints. This series is appropriate where vibration resistance provided by the push-pull mechanism is critical for long-term reliability.
This part belongs to the Preci-Dip 311 series of rectangular connectors. The series specializes in board-to-board applications requiring robust mechanical locking. Variations within the series differ primarily in position count and contact plating options. The 311-83 base designation indicates the standard product line configuration.
Direct substitutes must match the 11-position count, 2.54mm pitch, and push-pull locking style. Verify that alternative sockets maintain identical insulation height and thermal ratings. Cross-reference manufacturer datasheets to confirm compatible mating pins and PCB land pattern dimensions.
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