314-87-104-01-899101

314-87-104-01-899101

$0.32
  • Description:CONN SOCKET 4POS 0.1 GOLD SMD
  • Series:314
  • Mfr:Preci-Dip
  • Package:Bulk

SKU:5a0cbf30448f Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:CONN SOCKET 4POS 0.1 GOLD SMD
  • Series:314
  • Mfr:Preci-Dip
  • Package:Bulk
  • Connector Type:Socket
  • Contact Type:Female Socket
  • Style:Board to Board
  • Number of Positions:4
  • Number of Positions Loaded:All
  • Pitch - Mating:0.100" (2.54mm)
  • Number of Rows:1
  • Row Spacing - Mating:-
  • Mounting Type:Surface Mount
  • Termination:Solder
  • Fastening Type:Push-Pull
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:Flash
  • Insulation Color:Black
  • Insulation Height:0.165" (4.20mm)
  • Contact Length - Post:-
  • Operating Temperature:-55°C ~ 125°C
  • Material Flammability Rating:UL94 V-0
  • Contact Finish - Post:Tin
  • Mated Stacking Heights:-
  • Ingress Protection:-
  • Features:-
  • Current Rating (Amps):3A
  • Voltage Rating:-

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314-87-104-01-899101

Overview

The Preci-Dip 314-87-104-01-899101 is a surface-mount socket connector featuring four positions with a 2.54 mm pitch. It utilizes gold-plated contacts for reliable signal transmission and is designed for perpendicular mounting on printed circuit boards. The component supports low-profile applications, incorporating self-levelling floating contacts to ensure consistent mating force and connection stability despite board warpage or alignment variations.

Feature Summary

  • Surface-mount termination design reduces parasitic inductance compared to traditional through-hole headers
  • Self-levelling floating contact mechanism ensures stable mating force and connection reliability
  • Gold-plated contact surfaces provide durable electrical conductivity and corrosion resistance

Applications

  • Low-profile electronic assemblies requiring space-constrained interconnects
  • Applications demanding reduced parasitic inductance in signal paths
  • Board-to-board connections where self-levelling compensation is required

Procurement Notes

Verify the specific ordering suffix against official Preci-Dip documentation to confirm exact plating thickness and material specifications. Ensure that the surface-mount footprint dimensions align with the target PCB layout. Confirm RoHS compliance status if required by the end-product regulations. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components.

Selection Notes

Select this component when a low-profile surface-mount solution is necessary for four-position interconnects. The self-levelling feature makes it suitable for environments with potential board misalignment. Consider the gold plating for long-term reliability in signal-critical applications. Evaluate the perpendicular mounting orientation against available board real estate constraints.

Part Context

This model belongs to the Preci-Dip 314 series of SMD socket connectors. It shares the family's characteristic floating contact technology and 2.54 mm pitch standardization. Variations within the series typically differ by position count and termination style, while maintaining consistent mechanical interface requirements for compatible header counterparts.

Replacement Considerations

Direct substitutes include other Preci-Dip models from the 314 series with matching position counts and surface-mount termination. Verify that alternative parts maintain the same self-levelling functionality and gold plating specifications to ensure equivalent performance characteristics.

314-87-104-01-899101314-87-104-01-899101
$0.32
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