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323-2SURD/S530-A3 is listed in the LED Indication - Discrete range at ChipApex. The manufacturer field lists Everlight Electronics Co Ltd. Its product description is LED RED DIFFUSED 5MM ROUND T/H. Review the specifications below when checking this part for your BOM.
The 323-2SURD/S530-A3 is a through-hole LED lamp manufactured by Everlight Electronics Co Ltd. It features a 5.0 mm round lens with a diffused finish, emitting hyper red light at a peak wavelength of 624 nm. The component provides an optical intensity of 100 mcd and operates with a forward voltage of 2.4 V. Designed for standard PCB mounting, it utilizes a T-1 (3 mm) package configuration within the broader 5 mm LED lamp family.
Verify the specific datasheet version for the 323-2SURD/S530-A3 to confirm electrical tolerances and thermal characteristics. Ensure compatibility with existing assembly processes regarding lead forming and soldering temperatures. Cross-reference official Everlight documentation for any recent product change notifications or environmental compliance updates prior to finalizing procurement specifications.
Select this component when a diffused red indicator is required for panel applications. The 100 mcd intensity offers visibility suitable for general status signaling. Consider the 2.4 V forward voltage drop for power budget calculations. Compare against other Everlight T-1 variants if specific beam angles or color consistency requirements differ from standard hyper red specifications.
This part belongs to Everlight's standard through-hole LED lamp series, characterized by reliable performance in indicator applications. The S530 suffix typically denotes specific packaging or lot coding parameters defined by the manufacturer. It complements the company's broader portfolio of discrete optoelectronic components used in industrial and consumer hardware.
Consult official Everlight substitution guides for direct equivalents. Verify that alternative parts match the 624 nm wavelength, 100 mcd intensity, and 2.4 V forward voltage. Ensure mechanical dimensions align with existing PCB footprints and panel cutouts before implementing any substitute components.
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