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329-41-142-41-540000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 42POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 329-41-142-41-540000 is a single-row socket header strip designed for through-hole mounting. It features 142 positions with a 0.100-inch (2.54mm) pitch. The contacts are precision-machined receptacles accepting lead diameters of 0.015 to 0.025 inches. Plating code 41 indicates gold plating on the contact surfaces. The unit utilizes a solder cup termination type for secure board attachment.
Verify exact pin count and row configuration against schematic requirements before ordering. Confirm that the solder cup termination method aligns with the target printed circuit board fabrication capabilities. Ensure the accepted lead diameter range matches the mating component specifications to guarantee proper mechanical fit and electrical continuity during assembly processes.
Select this component when a single-row, high-pin-count socket is required for through-hole implementation. The 0.100-inch pitch ensures compatibility with standard DIP packages and ribbon cable systems. Consider the solder cup termination for superior mechanical strength compared to surface mount alternatives in vibration-prone environments.
This part belongs to the Mill-Max 329 series of interconnect socket strips. These components are characterized by their precision-machined contacts and through-hole solder cup design. The series offers various pin counts while maintaining consistent dimensional tolerances and material properties for reliable signal transmission in demanding electronic applications.
Direct substitutes must match the 142-position count, single-row layout, and 0.100-inch pitch. Verify that alternative manufacturers offer compatible solder cup terminations and similar contact plating specifications to ensure interchangeability without redesigning the host printed circuit board footprint.
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