32EM16-M4CTX29-8AD11

Overview

The Kingston Technology 32EM16-M4CTX29-8AD11 is an Embedded Multi-Chip Package (eMCP) integrating e•MMC™ 5.1 flash storage and LPDDR4X DRAM within a single JEDEC 254-ball FBGA Type package measuring 11.5 mm x 13.0 mm with a maximum height of 1.0 mm. The device provides 32 GB NAND density paired with 16 Gb DRAM capacity, operating at VCC=3.3V, VCCQ=1.8V, VDD1=1.8V, VDD2=1.1V, and VDDQ=0.6V. It supports an extended industrial operating temperature range from -25°C to +85°C.

Feature Summary

• Integrates managed NAND flash memory with an onboard controller for error control, wear-leveling, and performance optimization alongside LPDDR4X synchronous dynamic RAM in a compact multi-chip package.
• Supports high-speed HS400 bus modes with enhanced strobe signals for improved data throughput and reduced power consumption in mobile communication systems.
• Includes advanced security features such as Replay Protected Memory Block (RPMB), secure block erase commands, and permanent or partial write protection options.

Applications

• Data memory for mobile communication systems
• Embedded applications requiring reduced PCB size and optimized power consumption

Procurement Notes

Verify the specific part number against official Kingston documentation to ensure compatibility with your system's voltage requirements and interface standards. Confirm that the 254-ball FBGA package dimensions align with your printed circuit board layout constraints. Check for any recent revisions or updates to the specification sheet before finalizing procurement decisions.

Selection Notes

Select this component when designing embedded systems that require both high-capacity non-volatile storage and low-power volatile memory in a space-constrained environment. Ensure the host processor supports the e•MMC™ 5.1 standard and LPDDR4X interface protocols. Consider the industrial temperature rating if the application operates in varying environmental conditions.

Part Context

This eMCP belongs to Kingston's line of embedded multi-chip packages designed to simplify system design by combining memory and storage. It utilizes triple-level cell (TLC) NAND flash technology managed by an integrated controller, relieving the host processor of complex media management tasks while maintaining backward compatibility with prior e•MMC specifications.

Replacement Considerations

Consult official Kingston documentation for confirmed substitute part numbers. Verify pinout compatibility and electrical characteristics before considering alternatives.