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Product Detailed Parameters
- Description：IC FLASH RAM 256GBIT MMC 254FBGA
- Series：-
- Mfr：Kingston Technology
- Package：Tray
- Memory Type：-
- Memory Format：FLASH, RAM
- Technology：-
- Memory Size：256Gbit (NAND), 16Gbit (LPDDR4 DRAM)
- Memory Organization：-
- Memory Interface：eMMC 5.1 HS400 + LPDDR4X
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：254-FBGA (11.5x13x1.0)
- Access Time：-
- Grade：-
- Qualification：-
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Overview
The Kingston Technology 32EM16-M4JTQ0A-01011 is an embedded MultiMediaCard (eMCP) that integrates NAND flash and LPDDR4X DRAM within a single package. It features 32GB of NAND capacity and 16Gb of DRAM, adhering to eMMC 5.1 and LPDDR4X standards. The component utilizes a 254-ball FBGA package with dimensions of 11.5x13.0x1.0 mm. It operates reliably across an extended temperature range from -25°C to +85°C.
Feature Summary
- Integrates eMMC storage and LPDDR4X memory in a compact footprint
- Reduces PCB space and simplifies system integration
- Optimizes power efficiency for embedded applications
Applications
- Embedded systems requiring compact memory solutions
- IoT devices with size constraints
- Industrial control units
- Smart home appliances
Procurement Notes
Verify the exact part number against official Kingston documentation to ensure compatibility with your specific design requirements. Confirm the operating temperature range and package dimensions match your board layout. Check for any specific firmware configurations or ordering suffixes that may affect functionality. Ensure supply chain authenticity through authorized distributors.
Selection Notes
Select this component when designing embedded systems that require high integration density and reduced power consumption. The combination of eMMC 5.1 and LPDDR4X offers a balance of performance and efficiency suitable for modern IoT and industrial applications. Consider the physical dimensions and thermal characteristics during the PCB layout phase to ensure proper heat dissipation and fit.
Part Context
This eMCP belongs to Kingston's line of embedded memory solutions designed to simplify system design. By combining flash and DRAM into one device, it reduces component count and assembly complexity. This approach accelerates development cycles and optimizes projects for systems with strict size and power limitations, providing a reliable solution for next-generation embedded platforms.
