32EP16-M4FTC32-GA68

Overview

The Kingston 32EP16-M4FTC32-GA68 is an Embedded Package on Package (ePOP) device integrating a 32GB e•MMC™ 5.1 storage component with 16Gb LPDDR4X DRAM within a single JEDEC 144-ball FBGA package measuring 8.0 mm x 9.5 mm x 0.8 mm maximum height. The e•MMC portion utilizes triple-level cell (TLC) NAND flash managed by an onboard controller, supporting HS400 bus modes with sequential read speeds up to 280 MB/s and write speeds up to 35 MB/s. The LPDDR4X memory operates at 1.1V nominal core voltage and 0.6V I/O voltage, providing high-bandwidth data processing capabilities. The device supports an operating temperature range of –25°C to +85°C.

Feature Summary

• Integrates e•MMC™ 5.1 TLC NAND flash storage and LPDDR4X synchronous dynamic RAM into a single multi-chip package to reduce PCB footprint and power consumption.
• Features an onboard e•MMC™ controller that manages wear-leveling, error correction, and performance optimization, relieving the host processor of media management tasks.
• Supports multiple e•MMC™ bus modes including HS400 for high-speed data transfer and provides flexible partitioning options such as boot partitions and Replay Protected Memory Block (RPMB).

Applications

• Mobile communication systems requiring compact data memory solutions
• Embedded devices needing integrated storage and volatile memory in a space-constrained form factor
• Industrial applications operating within extended commercial temperature ranges

Procurement Notes

Verify the specific part number against official Kingston Digital documentation to confirm the exact density configuration and package type. Ensure compatibility with host system voltage requirements for both VCC/VCCQ and DRAM power rails. Confirm that the design accommodates the 144-ball FBGA footprint and thermal constraints associated with the ePOP architecture.

Selection Notes

Select this component when system design requires minimizing board space by combining non-volatile storage and volatile memory into one package. It is suitable for applications demanding high-speed data throughput via HS400 interfaces while maintaining low power consumption through LPDDR4X technology. Consider the available user capacity and partition structure for specific firmware and data storage needs.

Part Context

This device belongs to the Kingston Solutions Inc. (KSI) family of ePOP memory devices. These products are designed to meet JEDEC standards for both e•MMC™ 5.1 (JESD84-B51) and LPDDR4X (JESD209-4-1). The integration allows for simplified system design by reducing the number of components required for memory and storage functions in embedded environments.

Replacement Considerations

No public confirmed substitute part numbers are provided in the source material.