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333-017-521-607 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 17POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 333-017-521-607 is a standard card edge connector from the 333 series, designed for through-hole vertical mounting. It features 17 positions with a 3.96 mm (0.156 inch) pitch and accepts board thicknesses of 1.37 mm to 1.78 mm. The contacts are made of copper alloy with gold plating, rated for 3 A current. The housing is green thermoplastic polyester, offering an insulation resistance of 5 GOhms. Operating temperatures range from -40°C to +105°C.
Verify the specific suffix codes against official EDAC documentation to confirm exact pin count, contact plating thickness, and termination style. Ensure compatibility with target PCB thickness specifications before procurement. Confirm RoHS compliance status via the latest manufacturer datasheet to meet regulatory requirements for the intended deployment environment.
Select this component when a vertical, single-row connection is required for boards within the specified thickness range. The 3.96 mm pitch suits applications needing robust mechanical retention without surface mount constraints. Verify that the 3 A current rating aligns with the circuit load requirements and that the operating temperature range covers the environmental conditions of the final assembly.
This part belongs to the EDAC 333 series, which specializes in standard card edge connectors. The series offers various position counts and mounting styles, utilizing consistent 3.96 mm spacing. These connectors are engineered for high-reliability applications requiring secure mechanical locking and stable electrical contact between rigid printed circuit boards and mating edgeboards.
Cross-reference with other EDAC 333 series variants such as 333-014-558-808 or 333-020-521-604 for different position counts. Ensure identical pitch, mounting angle, and board thickness compatibility when substituting.
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