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337-018-520-608 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 18POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 337-018-520-608 is a standard card edge connector from the 337 series, designed for single-edge board insertion. It features 18 positions with a 3.96 mm (0.156 inch) pitch and accepts PCB thicknesses between 1.37 mm and 1.78 mm. The component utilizes female copper alloy contacts with gold plating and wire wrap termination. It is constructed with a thermoplastic polyester insulator, operates within a -40°C to +105°C range, and carries RoHS3 compliance.
Verify the specific ordering suffix against official EDAC documentation to confirm exact pin count, termination type, and mounting orientation. Ensure compatibility with target PCB thickness specifications before procurement. Confirm RoHS3 status requirements align with project environmental standards. Cross-reference datasheet dimensions for mechanical fit validation.
Select this connector when a single-row, 18-position interface with 3.96 mm pitch is required. Verify that the application supports wire wrap termination methods rather than surface mount or through-hole soldering. Ensure the mating card edge thickness falls within the specified 1.37 mm to 1.78 mm range for proper contact engagement.
This component belongs to the EDAC 337 series of standard card edge connectors. The series offers various position counts and mounting styles, utilizing consistent 3.96 mm pitch geometry. The 337-018-520-608 represents a specific variant optimized for single-edge applications with wire wrap capabilities.
Consult official EDAC cross-reference guides for verified substitutes. Generic equivalents may not match the precise wire wrap termination or dimensional tolerances required for reliable performance in existing assemblies.
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