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337-035-500-608 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 35POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 337-035-500-608 is a standard single-edge card edge connector designed for through-hole mounting. It features 35 positions with a contact spacing of 0.156 inches (3.96 mm) and a row spacing of 0.200 inches (5.08 mm). The connector accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). Constructed with a high-profile insulator body, it utilizes gold-plated copper alloy contacts to ensure reliable signal transmission.
Verify the specific suffix codes against the official EDAC ordering guide to confirm exact physical dimensions and plating specifications. Ensure compatibility with the target PCB thickness of 0.062 inches (1.57 mm) during integration. Confirm RoHS compliance status if required by project regulations before finalizing procurement orders.
Select this component when a vertical, single-edge connection is required for a 35-position interface. The 3.96 mm pitch accommodates standard board layouts while the 5.08 mm row spacing provides adequate clearance. The gold plating offers superior conductivity compared to tin alternatives for critical signal paths.
This part belongs to the EDAC 337 series, which specializes in standard card edge connectors. The series is characterized by its robust construction and suitability for harsh environments. EDAC provides comprehensive interconnect solutions tailored for demanding sectors such as medical and agricultural technologies.
Consult the EDAC 337 Series Ordering Guide for direct substitutes. Verify that alternative parts maintain the same 3.96 mm spacing and 1.57 mm board thickness tolerance to ensure mechanical fit.
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