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337-040-559-604 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 40POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC 337-040-559-604 is a standard card edge connector from the 337 series, designed for vertical through-hole mounting. It features 40 positions with a single row and a 3.96 mm pitch. The connector supports a PCB thickness of 1.57 mm and utilizes gold-plated copper alloy contacts rated for 3 A current. Insulation resistance is specified at 5 GOhms, with an operating temperature range from -40 C to +125 C.
Verify the specific datasheet for the 337-040-559-604 variant to confirm exact terminal type and flange configuration, as these attributes vary significantly within the 337 series. Ensure compatibility with the target PCB stack-up and mating card dimensions before finalizing procurement decisions.
Select this component when a single-row, vertical card edge interface is required for moderate pin counts. Verify that the 3.96 mm pitch aligns with the design constraints and that the 1.57 mm PCB thickness matches the assembly specifications. Confirm thermal requirements do not exceed the +125 C maximum rating.
This part belongs to the EDAC 337 series, which provides engineered solutions for power and signal transmission between motherboards, daughterboards, and extenders. The series offers various configurations in position count, row arrangement, and termination styles to suit diverse electronic assembly needs.
Public confirmed substitute part numbers are not available in the provided documentation. Cross-referencing requires matching electrical ratings, mechanical dimensions, and mounting style.
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