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337-056-542-858 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 56POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 337-056-542-858 is a standard card edge connector socket featuring 56 positions with a 3.96 mm (0.156 inch) pitch. Designed for dual-edge mating, it utilizes gold-plated copper alloy contacts and a green thermoplastic polyester insulator. The component supports through-hole vertical mounting and wire wrap termination. It accommodates PCBs up to 1.57 mm thick and provides an insulation resistance of 5 GOhms. Rated for 3 A current, the connector operates within a temperature range of -40°C to +105°C.
Verify the specific suffix against official EDAC documentation to confirm exact plating thickness and material specifications. Confirm that the dual-edge configuration matches the target PCB design requirements. Ensure compatibility with the specified 3.96 mm pitch and 1.57 mm board thickness constraints during procurement validation.
Select this model when a high-density 56-position connection is required with a wide 3.96 mm spacing. The dual-edge interface is suitable for applications demanding stable mechanical retention. Verify that the wire wrap termination method aligns with the assembly process and that the operating temperature range meets environmental conditions.
This component belongs to the EDAC 337 series of standard card edge connectors. The series is characterized by its use of thermoplastic polyester materials and gold-plated contacts. The 337 series provides various position counts and pitch options to support diverse electronic assembly needs.
Cross-reference part numbers such as 337-056-541-878 or 337-056-542-203 for alternative configurations within the same series. Verify dimensional and electrical compatibility before substitution.
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